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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT ROUND TYPE LED LAMPS LHY2643-1-PF DATA SHEET DOC. NO : REV. DATE : : QW0905- LHY2643-1-PF A 25 - Apr. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHY2643-1-PF Page 1/5 Package Dimensions 2.9 3.1 3.3 4.3 1.5MAX 25.0MIN 0.5 TYP 1.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHY2643-1-PF Page 2/5 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol HY Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 60 75 10 2000 -40 ~ +85 -40 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT g A V J J Typical Electrical & Optical Characteristics (Ta=25 J ) PART NO MATERIAL Emitted COLOR Lens Water Clear Forward Dominant Spectral voltage wave halfwidth @ 20mA(V) length f nm f Dnm Luminous intensity @20mA(mcd) Viewing angle 2c 1/2 (deg) Min. Max. Min. 595 15 1.7 2.6 300 Typ. 550 40 LHY2643-1-PF AlGaInP Yellow Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHY2643-1-PF Page3/5 Typical Electro-Optical Characteristics Curve HY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) 100 10 1.0 0.1 1.0 1.5 2.0 2.5 3.0 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25J Forward Voltage@20mA Normalize @25J 1.1 1.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 0.9 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHY2643-1-PF Recommended Soldering Conditions 1. Wave Solder Soldering Soldering Iron:30W Max Temperature 300C Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Page 4/5 Temp(C) 245C 5sec Max 245 2/sec max 120 Preheat 2/sec max 2/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120 C Max Preheat time: 120 seconds Max Ramp-up:2C/sec(max) Ramp-Down:2C/sec(max) Solder Bath:245C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) 2. PB-Free Wave Solder Temp(C) 265C 5sec Max 265 Soldering Soldering Iron:30W Max Temperature:350 CMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) 120 Preheat 2/sec max 2/sec max 2/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120 C Max Preheat time: 120seconds Max Ramp-up:2C/sec(max) Ramp-Down:2C/sec(max) Solder Bath:265C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHY2643-1-PF Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles 5J The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test 1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec |
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